JPH069510Y2 - 基準孔付半導体素子用パッケージ - Google Patents

基準孔付半導体素子用パッケージ

Info

Publication number
JPH069510Y2
JPH069510Y2 JP13953088U JP13953088U JPH069510Y2 JP H069510 Y2 JPH069510 Y2 JP H069510Y2 JP 13953088 U JP13953088 U JP 13953088U JP 13953088 U JP13953088 U JP 13953088U JP H069510 Y2 JPH069510 Y2 JP H069510Y2
Authority
JP
Japan
Prior art keywords
reference hole
package
hole forming
holes
package body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13953088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0260243U (en]
Inventor
公明 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP13953088U priority Critical patent/JPH069510Y2/ja
Publication of JPH0260243U publication Critical patent/JPH0260243U/ja
Application granted granted Critical
Publication of JPH069510Y2 publication Critical patent/JPH069510Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
JP13953088U 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ Expired - Lifetime JPH069510Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13953088U JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13953088U JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0260243U JPH0260243U (en]) 1990-05-02
JPH069510Y2 true JPH069510Y2 (ja) 1994-03-09

Family

ID=31402875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13953088U Expired - Lifetime JPH069510Y2 (ja) 1988-10-26 1988-10-26 基準孔付半導体素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH069510Y2 (en])

Also Published As

Publication number Publication date
JPH0260243U (en]) 1990-05-02

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